发明授权
- 专利标题： Conductive bump with a plurality of contact elements
- 专利标题（中）： 具有多个接触元件的导电凸块
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申请号： US11315138申请日： 2005-12-21
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公开(公告)号： US07550846B2公开(公告)日： 2009-06-23
- 发明人: John C. Knights
- 申请人： John C. Knights
- 申请人地址： US CA Palo Alto
- 专利权人： Palo Alto Research Center
- 当前专利权人： Palo Alto Research Center
- 当前专利权人地址： US CA Palo Alto
- 代理机构： Marger Johnson & McCollom, PC
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/44
摘要：
A method of forming a contact structure and a contact structure. The contact structure includes a contact location, and contact elements disposed substantially on the contact location, at least one such contact element including a deformable center and a conducting layer covering at least a part of the deformable center.
公开/授权文献
- US20070138649A1 Contact structure formed by jet printing 公开/授权日：2007-06-21
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