Invention Grant
- Patent Title: Micro-relay and method of fabricating the same
- Patent Title (中): 微型继电器及其制造方法
-
Application No.: US10634876Application Date: 2003-08-06
-
Publication No.: US07551048B2Publication Date: 2009-06-23
- Inventor: Hideki Iwata , Takashi Yuba , Hirofumi Saso
- Applicant: Hideki Iwata , Takashi Yuba , Hirofumi Saso
- Applicant Address: JP Tokyo
- Assignee: Fujitsu Component Limited
- Current Assignee: Fujitsu Component Limited
- Current Assignee Address: JP Tokyo
- Agency: Staas & Halsey LLP
- Priority: JP2002-232182 20020808; JP2002-232183 20020808; JP2002-232184 20020808; JP2002-324384 20021107
- Main IPC: H01H51/22
- IPC: H01H51/22
Abstract:
A micro-relay includes a first substrate having stationary contacts and a stationary electrode, a second substrate arranged so as to face the first substrate, and a movable plate arranged between the first and second substrates. The movable plate has a frame and a movable portion. The frame is sandwiched between the first and second substrates to realize a hermetical sealed structure. The movable portion has a movable electrode facing the stationary electrode, and a movable contact faces the stationary contacts. The movable portion moves between the first and second substrates due to electrostatic attraction that develops between the movable electrode and the stationary electrode.
Public/Granted literature
- US20050280975A1 Micro-relay and method of fabricating the same Public/Granted day:2005-12-22
Information query
