Invention Grant
US07554068B2 Heat radiating structure for solid-state image sensor, and solid-state image pickup device 有权
固态图像传感器的散热结构,以及固态摄像装置

Heat radiating structure for solid-state image sensor, and solid-state image pickup device
Abstract:
In a heat radiating member which has a contact portion to be put into contact with a solid-state image sensor fixed to a prism member, and a fin-like heat radiating portion for radiating heat, which has been transferred through the contact portion, into its surrounding gas, the contact portion and the heat radiating portion are formed from a foil member made of a high heat conductivity material. By mounting the heat radiating member on the solid-state image sensor, there is realized a heat radiating structure for cooling the solid-state image sensor while reducing external-force loads applied to the solid-state image sensor with a relatively simple structure.
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