Invention Grant
- Patent Title: Heat radiating structure for solid-state image sensor, and solid-state image pickup device
- Patent Title (中): 固态图像传感器的散热结构,以及固态摄像装置
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Application No.: US12028109Application Date: 2008-02-08
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Publication No.: US07554068B2Publication Date: 2009-06-30
- Inventor: Miyoko Irikiin , Yukihiro Iwata , Shinya Ogasawara
- Applicant: Miyoko Irikiin , Yukihiro Iwata , Shinya Ogasawara
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2007-030212 20070209; JP2007-206496 20070808
- Main IPC: H01L27/00
- IPC: H01L27/00

Abstract:
In a heat radiating member which has a contact portion to be put into contact with a solid-state image sensor fixed to a prism member, and a fin-like heat radiating portion for radiating heat, which has been transferred through the contact portion, into its surrounding gas, the contact portion and the heat radiating portion are formed from a foil member made of a high heat conductivity material. By mounting the heat radiating member on the solid-state image sensor, there is realized a heat radiating structure for cooling the solid-state image sensor while reducing external-force loads applied to the solid-state image sensor with a relatively simple structure.
Public/Granted literature
- US20080191124A1 HEAT RADIATING STRUCTURE FOR SOLID-STATE IMAGE SENSOR, AND SOLID-STATE IMAGE PICKUP DEVICE Public/Granted day:2008-08-14
Information query
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