发明授权
US07560307B2 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same
有权
树脂组合物，耐热树脂膏和使用这些的半导体器件及其制备方法
- 专利标题： Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same
- 专利标题（中）： 树脂组合物，耐热树脂膏和使用这些的半导体器件及其制备方法
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申请号： US11403810申请日： 2006-04-14
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公开(公告)号： US07560307B2公开(公告)日： 2009-07-14
- 发明人: Yasuhiro Yano , Hidekazu Matsuura , Yoshihiro Nomura , Yoshii Morishita , Touichi Sakata , Hiroshi Nishizawa , Toshiaki Tanaka , Masaaki Yasuda , Aizou Kaneda
- 申请人： Yasuhiro Yano , Hidekazu Matsuura , Yoshihiro Nomura , Yoshii Morishita , Touichi Sakata , Hiroshi Nishizawa , Toshiaki Tanaka , Masaaki Yasuda , Aizou Kaneda
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JP2000-65718 20000306; JP2000-70975 20000309; JP2000-71023 20000309; JP2000-71024 20000309; JP2000-71025 20000309; JP2000-224762 20000726
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L21/48 ; H01L21/44 ; H01L21/4763 ; H01L21/469 ; H01L21/31
摘要：
There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.
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