发明授权
- 专利标题: Semiconductor device
- 专利标题(中): 半导体器件
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申请号: US11634384申请日: 2006-12-06
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公开(公告)号: US07560811B2公开(公告)日: 2009-07-14
- 发明人: Shingo Sakakibara , Hiroshi Saitoh , Toshihisa Suzuki
- 申请人: Shingo Sakakibara , Hiroshi Saitoh , Toshihisa Suzuki
- 申请人地址: JP Shizuoka-Ken
- 专利权人: Yamaha Corporation
- 当前专利权人: Yamaha Corporation
- 当前专利权人地址: JP Shizuoka-Ken
- 代理机构: Dickstein Shapiro LLP
- 优先权: JP2005-354458 20051208; JP2005-354459 20051208; JP2005-376396 20051227; JP2006-021164 20060130; JP2006-048351 20060224; JP2006-303717 20061109; JP2006-303837 20061109
- 主分类号: H01L29/82
- IPC分类号: H01L29/82
摘要:
A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.
公开/授权文献
- US20070210392A1 Semiconductor device 公开/授权日:2007-09-13