An inventive method in an integrated circuit (IC) manufacturing process for using data regarding repair procedures conducted on ICs at probe to determine whether any further repairs will be conducted later in the manufacturing process includes storing the data in association with a fuse ID of each of the ICs. The ID codes of the ICs are automatically read, for example, at an opens/shorts test during the manufacturing process. The data stored in association with the ID codes of the ICs is then accessed, and additional repair procedures the ICs may undergo are selected in accordance with the accessed data. Thus, for example, the accessed data may indicate that an IC is unrepairable, so the IC can proceed directly to a scrap bin without having to be queried to determine whether it is repairable, as is necessary in traditional IC manufacturing processes.