发明授权
- 专利标题： Integrated circuit package system with interconnect support
- 专利标题（中）： 具有互连支持的集成电路封装系统
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申请号： US11456532申请日： 2006-07-10
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公开(公告)号： US07563647B2公开(公告)日： 2009-07-21
- 发明人: Henry D. Bathan , Il Kwon Shim , Jeffrey D. Punzalan , Zigmund Ramirez Camacho
- 申请人： Henry D. Bathan , Il Kwon Shim , Jeffrey D. Punzalan , Zigmund Ramirez Camacho
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01R43/00 ; H01L23/495
摘要：
An integrated circuit package system with interconnect support is provided including providing an integrated circuit, forming an electrical interconnect on the integrated circuit, forming a contact pad having a chip support, and coupling the integrated circuit to the contact pad by the electrical interconnect, with the integrated circuit on the chip support.
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