An apparatus for placing mold charges into a mold of a compression molding machine includes a carrier, an arm pivotally mounted on the carrier and a mold charge pick-up cup on the arm at a position spaced from the carrier. The arm is pivotal on the carrier between a first position at which the arm is positioned to deposit a mold charge into a mold and a second position at which the mold charge pick-up cup is disposed to transport the mold charge. The carrier preferably is mounted for rotation around an axis. In some embodiments, a cam mechanism is coupled to the arm to pivot the arm as a function of rotation of the carrier. A spring may be coupled between the arm and the carrier for biasing the arm toward one of the first and second positions of the arm. In another embodiment, an actuator is carried by the carrier and coupled to the arm to pivot the arm with respect to the carrier. The arm preferably includes a passage for selective application of air and/or vacuum to the mold charge pick-up cup.