发明授权
US07566593B2 Fuse structure including cavity and methods for fabrication thereof
失效
保险丝结构，包括腔体及其制造方法
- 专利标题： Fuse structure including cavity and methods for fabrication thereof
- 专利标题（中）： 保险丝结构，包括腔体及其制造方法
-
申请号： US11538170申请日： 2006-10-03
-
公开(公告)号： US07566593B2公开(公告)日： 2009-07-28
- 发明人: Anil K. Chinthakindi , Deok-kee Kim , Chandrasekharan Kothandaraman
- 申请人： Anil K. Chinthakindi , Deok-kee Kim , Chandrasekharan Kothandaraman
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Scully, Scott, Murphy & Presser, P.C.
- 代理商 Lisa U. Jaklitsch
- 主分类号： H01L21/82
- IPC分类号： H01L21/82
摘要：
A fuse structure comprises a cavity interposed between a substrate and a fuse material layer. The cavity is not formed at a sidewall of the fuse material layer, or at a surface of the fuse material layer opposite the substrate. A void may be formed interposed between the substrate and the fuse material layer while using a self-aligned etching method, when the fuse material layer comprises lobed ends and a narrower middle region. The void is separated by a pair of sacrificial layer pedestals that support the fuse material layer. The void is encapsulated to form the cavity by using an encapsulating dielectric layer. Alternatively, a block mask may be used when forming the void interposed between the substrate and the fuse material layer.
公开/授权文献
信息查询
IPC分类:
