发明授权
- 专利标题： Integrated metrology tools for monitoring and controlling large area substrate processing chambers
- 专利标题（中）： 用于监测和控制大面积基板处理室的综合计量工具
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申请号： US11216801申请日： 2005-08-31
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公开(公告)号： US07566900B2公开(公告)日： 2009-07-28
- 发明人: Hienminh Huu Le , Akihiro Hosokawa
- 申请人： Hienminh Huu Le , Akihiro Hosokawa
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Patterson & Sheridan, LLP
- 主分类号： H01L29/10
- IPC分类号： H01L29/10
摘要：
Embodiments of an apparatus and method of monitoring and controlling a large area substrate processing chamber are provided. Multiple types of metrology tools can be installed in the substrate processing system to measure film properties after substrate processing in a processing chamber. Several number of a particular type of metrology tools can also be installed in the substrate processing system to measure film properties after substrate processing in a processing chamber. The metrology tools can be installed in a metrology chamber, a process chamber, a transfer chamber, or a loadlock.
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