Invention Grant
- Patent Title: Hinge assembly for foldable electronic device
- Patent Title (中): 可折叠电子装置的铰链总成
-
Application No.: US11565516Application Date: 2006-11-30
-
Publication No.: US07568261B2Publication Date: 2009-08-04
- Inventor: Sheng-Cheng Hsu , Wen-Lin Gan , Lian-Cheng Huang
- Applicant: Sheng-Cheng Hsu , Wen-Lin Gan , Lian-Cheng Huang
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Steven M. Reiss
- Priority: CN200610061652 20060714
- Main IPC: E05D3/10
- IPC: E05D3/10

Abstract:
An exemplary hinge assembly (10) includes a base body (12), a bracket (14), a support board (18), a pivotal mechanism (16) and a rotational mechanism. The pivotal mechanism includes a pivotal shaft (163) fixed to the base body and rotatable relative to the bracket, an elastic member (165) and a fixing member (167). The rotational mechanism includes a rotational shaft (191), a rotary member (193), a steady member (195) and an elastic member (197). The support board and the rotary member are rotatable relative to the steady member, the base body, the bracket and the pivotal mechanism around a second axis. Each of the rotary member and the steady member defines an engaging surface (1932, 1951). One of the engaging surfaces forms at least one peak (1933), and the other of the engaging surfaces defines at least one valley (1953) corresponding to the peak.
Public/Granted literature
- US20080078061A1 HINGE ASSEMBLY FOR FOLDABLE ELECTRONIC DEVICE Public/Granted day:2008-04-03
Information query