Invention Grant
- Patent Title: Package removal device
- Patent Title (中): 包装拆卸装置
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Application No.: US11316009Application Date: 2005-12-21
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Publication No.: US07568280B2Publication Date: 2009-08-04
- Inventor: Zhao-Lue Zeng , Hsuan-Jen Kung , Jin-Yue Kang , Yuan-Chiu Lin
- Applicant: Zhao-Lue Zeng , Hsuan-Jen Kung , Jin-Yue Kang , Yuan-Chiu Lin
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Hong Fu Jin Preicision Industry (Shen Zhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Preicision Industry (Shen Zhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Priority: CN200420103467U 20041224
- Main IPC: H01R43/00
- IPC: H01R43/00

Abstract:
A package removal device is for removing a package (5) from a component band (1) to expose a carrier band (2). The package removal device includes a stand (10), a first scrolling unit includes a first gear (52), and a second scrolling unit includes a second gear (85). The stand includes a platform (12) with an import end (14a) and an export end (14b). The export end includes a locating gear (18) mounted thereon, a first exit (24), and a second exit (22). The component band is separated into the package and the carrier band in the export end. The first gear meshes with the second gear to output the package from the first exit. The locating gear engages the carrier band to output the carrier band from the second exit.
Public/Granted literature
- US20060142133A1 Package removal device Public/Granted day:2006-06-29
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