Invention Grant
- Patent Title: Method of determining stress
- Patent Title (中): 确定应力的方法
-
Application No.: US11554574Application Date: 2006-10-30
-
Publication No.: US07568396B2Publication Date: 2009-08-04
- Inventor: Jun He , Jun Zhao , Ming Li Tan
- Applicant: Jun He , Jun Zhao , Ming Li Tan
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: G01B7/16
- IPC: G01B7/16
Abstract:
A micromachined strain gauge comprising a plastically deformable piezoresistive microstructure formed on a surface of a substrate so that deformation of the substrate plastically deforms the microstructure to thereby change the resistance of the microstructure. The stress in the substrate can be determined from the change in the resistance of the microstructure.
Public/Granted literature
- US20070056381A1 Method Of Determining Stress Public/Granted day:2007-03-15
Information query
