Invention Grant
- Patent Title: High speed modular jack including multiple contact blocks and method for assembling same
- Patent Title (中): 包括多个接触块的高速模块插座及其组装方法
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Application No.: US11748674Application Date: 2007-05-15
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Publication No.: US07568950B2Publication Date: 2009-08-04
- Inventor: Yakov Belopolsky , David Gutter , Richard Marowsky
- Applicant: Yakov Belopolsky , David Gutter , Richard Marowsky
- Applicant Address: HK San Po Kong, Kowloon
- Assignee: Bel Fuse Ltd.
- Current Assignee: Bel Fuse Ltd.
- Current Assignee Address: HK San Po Kong, Kowloon
- Agent Cozen O'Connor
- Main IPC: H01R13/648
- IPC: H01R13/648

Abstract:
A high speed jack capable of handling Category 7 communications. The jack comprises a shield and a housing inside the shield. The housing defines four distinct chambers for holding at least a first, second third, and fourth contact block, each contact block including at least two contacts. The contact blocks may be disposed symmetrically about a central axis of the housing. A horizontal shield and a vertical shield are disposed in the housing and shield the contacts from one another.
Public/Granted literature
- US20070270034A1 High Speed Modular Jack Public/Granted day:2007-11-22
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