发明授权
- 专利标题： Contacts for electrochemical processing
- 专利标题（中）： 电化学处理接点
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申请号： US11424170申请日： 2006-06-14
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公开(公告)号： US07569134B2公开(公告)日： 2009-08-04
- 发明人: Paul Butterfield , Liang-Yuh Chen , Yongqi Hu , Antoine Manens , Rashid Mavliev , Stan Tsai
- 申请人： Paul Butterfield , Liang-Yuh Chen , Yongqi Hu , Antoine Manens , Rashid Mavliev , Stan Tsai
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Patterson & Sheridan, LLP
- 主分类号： B23H5/06
- IPC分类号： B23H5/06 ; C25D17/00
摘要：
Systems and methods for electrochemically processing a substrate. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one embodiment, the contact element comprises a noble metal.
公开/授权文献
- US20060231414A1 CONTACTS FOR ELECTROCHEMICAL PROCESSING 公开/授权日：2006-10-19
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