发明授权
- 专利标题: Wired circuit board
- 专利标题(中): 有线电路板
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申请号: US11902556申请日: 2007-09-24
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公开(公告)号: US07569773B2公开(公告)日: 2009-08-04
- 发明人: Szu-Han Hu , Voon Yee Ho , Hiroshi Yamazaki , Martin John McCaslin
- 申请人: Szu-Han Hu , Voon Yee Ho , Hiroshi Yamazaki , Martin John McCaslin
- 申请人地址: JP Osaka
- 专利权人: Nitto Denko Corporation
- 当前专利权人: Nitto Denko Corporation
- 当前专利权人地址: JP Osaka
- 代理机构: Akerman Senterfitt
- 代理商 Jean C. Edwards, Esq.
- 优先权: JP2006-271036 20061002
- 主分类号: H01B7/08
- IPC分类号: H01B7/08
摘要:
A wired circuit board has a plurality of insulating layers, a conductive layer having a signal wiring extending in a longitudinal direction which is covered with the insulating layers, and a signal connecting terminal provided on a longitudinal end of the signal wiring and exposed from the insulating layers, and a ground layer having a ground wiring covered with the insulating layers and formed to surround the signal wiring in a perpendicular direction to the longitudinal direction, and a ground connecting terminal provided on a longitudinal end of the ground wiring and exposed from the insulating layers. The signal connecting terminal and the ground connecting terminal are formed on an upper surface of the same insulating layer among the plurality of the insulating layers.
公开/授权文献
- US20080087455A1 Wired circuit board 公开/授权日:2008-04-17