发明授权
- 专利标题： Variable spring rate thermal management apparatus attachment mechanism
- 专利标题（中）： 可变弹簧温度管理装置附件机构
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申请号： US11162163申请日： 2005-08-31
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公开(公告)号： US07570490B2公开(公告)日： 2009-08-04
- 发明人: Gamal Refai-Ahmed , Robert Wiley , Steven Chan , Nima Osqueizadeh , Salim Lakhani
- 申请人： Gamal Refai-Ahmed , Robert Wiley , Steven Chan , Nima Osqueizadeh , Salim Lakhani
- 申请人地址： CA Markham, Ontario
- 专利权人： ATI Technologies ULC
- 当前专利权人： ATI Technologies ULC
- 当前专利权人地址： CA Markham, Ontario
- 代理机构： Vedder Price P.C.
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; F25D23/00
摘要：
A device to thermally couple a thermal management apparatus to at least one heat generating component of a circuit substrate includes at least a first portion that is adapted to couple to the thermal management apparatus, and at least a second portion that is adapted to couple to the thermal management apparatus. The first portion and the second portion may be symmetrically arranged relative to each other. The first portion and the second portion are adapted to thermally couple the thermal management apparatus to the heat generating component with a first spring bias. The first portion and the second portion are further adapted to maintain the thermal management apparatus thermally coupled to the heat generating component with a second spring bias.
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