Invention Grant
- Patent Title: Variable spring rate thermal management apparatus attachment mechanism
- Patent Title (中): 可变弹簧温度管理装置附件机构
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Application No.: US11162163Application Date: 2005-08-31
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Publication No.: US07570490B2Publication Date: 2009-08-04
- Inventor: Gamal Refai-Ahmed , Robert Wiley , Steven Chan , Nima Osqueizadeh , Salim Lakhani
- Applicant: Gamal Refai-Ahmed , Robert Wiley , Steven Chan , Nima Osqueizadeh , Salim Lakhani
- Applicant Address: CA Markham, Ontario
- Assignee: ATI Technologies ULC
- Current Assignee: ATI Technologies ULC
- Current Assignee Address: CA Markham, Ontario
- Agency: Vedder Price P.C.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F25D23/00
Abstract:
A device to thermally couple a thermal management apparatus to at least one heat generating component of a circuit substrate includes at least a first portion that is adapted to couple to the thermal management apparatus, and at least a second portion that is adapted to couple to the thermal management apparatus. The first portion and the second portion may be symmetrically arranged relative to each other. The first portion and the second portion are adapted to thermally couple the thermal management apparatus to the heat generating component with a first spring bias. The first portion and the second portion are further adapted to maintain the thermal management apparatus thermally coupled to the heat generating component with a second spring bias.
Public/Granted literature
- US20070047211A1 VARIABLE SPRING RATE THERMAL MANAGEMENT APPARATUS ATTACHMENT MECHANISM Public/Granted day:2007-03-01
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