发明授权
- 专利标题： Printed circuit board with embedded capacitors therein, and process for manufacturing the same
- 专利标题（中）： 具有嵌入式电容器的印刷电路板及其制造方法
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申请号： US10728591申请日： 2003-12-04
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公开(公告)号： US07570491B2公开(公告)日： 2009-08-04
- 发明人: Seok-Kyu Lee , Byoung-Youl Min , Chang-Hyun Nam , Hyun-Ju Jin , Jang-Kyu Kang
- 申请人： Seok-Kyu Lee , Byoung-Youl Min , Chang-Hyun Nam , Hyun-Ju Jin , Jang-Kyu Kang
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： Christensen O'Connor Johnson Kindness PLLC
- 优先权： KR10-2002-0082648 20021223
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K1/16
摘要：
Disclosed herein is a printed circuit board with embedded capacitors therein which comprises inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of BaTiO3 and an epoxy resin, and a process for manufacturing the printed circuit board.
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