Invention Grant
- Patent Title: Printed circuit board with embedded capacitors therein, and process for manufacturing the same
- Patent Title (中): 具有嵌入式电容器的印刷电路板及其制造方法
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Application No.: US10728591Application Date: 2003-12-04
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Publication No.: US07570491B2Publication Date: 2009-08-04
- Inventor: Seok-Kyu Lee , Byoung-Youl Min , Chang-Hyun Nam , Hyun-Ju Jin , Jang-Kyu Kang
- Applicant: Seok-Kyu Lee , Byoung-Youl Min , Chang-Hyun Nam , Hyun-Ju Jin , Jang-Kyu Kang
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Christensen O'Connor Johnson Kindness PLLC
- Priority: KR10-2002-0082648 20021223
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/16
Abstract:
Disclosed herein is a printed circuit board with embedded capacitors therein which comprises inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of BaTiO3 and an epoxy resin, and a process for manufacturing the printed circuit board.
Public/Granted literature
- US20040121266A1 Printed circuit board with embedded capacitors therein, and process for manufacturing the same Public/Granted day:2004-06-24
Information query
