Invention Grant
- Patent Title: Packing materials for module of display apparatus
- Patent Title (中): 显示装置模块用包装材料
-
Application No.: US11427122Application Date: 2006-08-11
-
Publication No.: US07571808B2Publication Date: 2009-08-11
- Inventor: Junhee Kong , Deoksoo Kim , Kwaneun Jin
- Applicant: Junhee Kong , Deoksoo Kim , Kwaneun Jin
- Applicant Address: KR Seoul
- Assignee: LG Electronics Inc.
- Current Assignee: LG Electronics Inc.
- Current Assignee Address: KR Seoul
- Agency: Fish & Richardson P.C.
- Priority: KR10-2006-0019011 20060227
- Main IPC: B65D85/38
- IPC: B65D85/38
Abstract:
The packing materials for the module of the display apparatus comprise a plane frame having an opening in its center, a side frame formed to be connected to the plane frame in the direction approximately perpendicular to the circumference of the plane frame, a combination unit formed on the rear surface of the plane frame and a guiding unit mounted at the corner of the side frame and combined with the combination unit.
Public/Granted literature
- US20070205117A1 PACKING MATERIALS FOR MODULE OF DISPLAY APPARATUS Public/Granted day:2007-09-06
Information query
IPC分类:
