发明授权
US07572337B2 Blocker plate bypass to distribute gases in a chemical vapor deposition system
有权
阻挡板旁路以在化学气相沉积系统中分配气体
- 专利标题: Blocker plate bypass to distribute gases in a chemical vapor deposition system
- 专利标题(中): 阻挡板旁路以在化学气相沉积系统中分配气体
-
申请号: US11131010申请日: 2005-05-16
-
公开(公告)号: US07572337B2公开(公告)日: 2009-08-11
- 发明人: Juan Carlos Rocha-Alvarez , Ganesh Balasubramanian , Tom K. Cho , Deenesh Padhi , Thomas Nowak , Bok Hoen Kim , Hichem M'Saad , Daemian Raj
- 申请人: Juan Carlos Rocha-Alvarez , Ganesh Balasubramanian , Tom K. Cho , Deenesh Padhi , Thomas Nowak , Bok Hoen Kim , Hichem M'Saad , Daemian Raj
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Patterson & Sheridan
- 主分类号: C23C16/455
- IPC分类号: C23C16/455 ; C23F1/00 ; H01L21/306 ; C23C16/06 ; C23C16/22
摘要:
Apparatus and methods for distributing gases into a processing chamber are disclosed. In one embodiment, the apparatus includes a gas distribution plate having a plurality of apertures disposed therethrough and a blocker plate having both a plurality of apertures disposed therethrough and a plurality of feed through passageways disposed therein. A first gas pathway delivers a first gas through the plurality of apertures in the blocker plate and the gas distribution plate. A bypass gas pathway delivers a second gas through the plurality of feed through passageways in the blocker plate and to areas around the blocker plate prior to the second gas passing through the gas distribution plate.
公开/授权文献
信息查询
IPC分类: