发明授权
- 专利标题： Tape removal in semiconductor structure fabrication
- 专利标题（中）： 半导体结构制造中的磁带去除
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申请号： US10905914申请日： 2005-01-26
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公开(公告)号： US07572739B2公开(公告)日： 2009-08-11
- 发明人: Steven R. Codding , Timothy C Krywanczyk , Steven G. Perrotte , Jason P. Ritter
- 申请人： Steven R. Codding , Timothy C Krywanczyk , Steven G. Perrotte , Jason P. Ritter
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Schmeiser, Olsen & Watts
- 代理商 William D. Sabo
- 主分类号： H01L21/302
- IPC分类号： H01L21/302 ; H01L21/461
摘要：
A semiconductor structure fabrication method for removing a tape physically attached to a device side of the semiconductor substrate by an adhesive layer of the tape, wherein the adhesive layer comprises an adhesive material. The method includes the step of submerging the tape in a liquid chemical comprising monoethanolamine or an alkanolamine for a pre-specified period of time sufficient to allow for a separation of the tape from the semiconductor substrate without damaging devices on the semiconductor substrate.
公开/授权文献
- US20060163204A1 TAPE REMOVAL IN SEMICONDUCTOR STRUCTURE FABRICATION 公开/授权日：2006-07-27
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