发明授权
- 专利标题： Method of forming a metal line and method of manufacturing a display substrate by using the same including etching and undercutting the channel layer
- 专利标题（中）： 金属线的形成方法以及使用包括蚀刻和底切沟道层的显示基板的制造方法
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申请号： US11669653申请日： 2007-01-31
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公开(公告)号： US07575945B2公开(公告)日： 2009-08-18
- 发明人: Jang-Soo Kim , Sang-Gab Kim
- 申请人： Jang-Soo Kim , Sang-Gab Kim
- 申请人地址： KR Suwon-si, Gyeonggi-do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si, Gyeonggi-do
- 代理机构： F. Chau & Associate
- 优先权： KR10-2006-0036745 20060424
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/302 ; H01L21/461
摘要：
In a method of forming a metal line and a method of manufacturing a display substrate, a channel layer and a metal layer are successively formed on a base substrate. A photoresist pattern is formed in a wiring area. The metal layer is etched by using the photoresist pattern to form a metal line. The photoresist pattern is removed by a predetermined thickness to form a residual photoresist pattern on the metal line. The channel layer is etched by using the metal line to form an undercut under the metal line. The protruding portion of the metal line is removed by using the residual photoresist pattern. The protruding portion relatively protrudes by formation of the undercut. Thus, an aperture ratio is increased, an afterimage is prevented, and the display quality is improved.
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