发明授权
- 专利标题： Fabrication method for semiconductor package heat spreaders
- 专利标题（中）： 半导体封装散热器的制造方法
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申请号： US10721916申请日： 2003-11-24
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公开(公告)号： US07575956B2公开(公告)日： 2009-08-18
- 发明人: Virgil Cotoco Ararao , Il Kwon Shim , Seng Guan Chow , Sheila Marie L. Alvarez
- 申请人： Virgil Cotoco Ararao , Il Kwon Shim , Seng Guan Chow , Sheila Marie L. Alvarez
- 申请人地址： SG Singapore
- 专利权人： ST Assembly Test Services Ltd.
- 当前专利权人： ST Assembly Test Services Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A method for fabricating a semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least one external reversing bend. The channel walls depend from the panel to define a channel between the channel walls and the panel for receiving a semiconductor therein. The feet extend from respective channel walls for attachment to a substrate.
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