发明授权
- 专利标题： Lead frame structure and applications thereof
- 专利标题（中）： 引线框架结构及其应用
-
申请号： US12167622申请日： 2008-07-03
-
公开(公告)号： US07576418B2公开(公告)日： 2009-08-18
- 发明人: Chia-Yu Chen , Ta-Lin Pong , En-Shou Chang , I-Chi Cheng , Chen-Ping Su
- 申请人： Chia-Yu Chen , Ta-Lin Pong , En-Shou Chang , I-Chi Cheng , Chen-Ping Su
- 申请人地址： TW Kaohsiung
- 专利权人： Orient Semiconductor Electronics, Ltd.
- 当前专利权人： Orient Semiconductor Electronics, Ltd.
- 当前专利权人地址： TW Kaohsiung
- 代理机构： Muncy, Geissler, Olds & Lowe, PLLC
- 优先权： TW96142746A 20071112
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A lead frame structure comprises a side rail, a first paddle, a second paddle, a plurality of leads, and an downset anchor bar. The first paddle is connected to the side rail via at least one first tie bar, and the second paddle is connected to the side rail via at least one-second tie bar. The first paddle and the second paddle separated from each other are used to define an area to support a chip. These leads set on the side rail expends toward to the chip supporting area. One end of the downset anchor bar is connected to the side rail, and the other end of the downset anchor bar has a protrusion portion which is between the first paddle and the second paddle and is downset from the side rail.
公开/授权文献
- US20090121329A1 LEAD FRAME STRUCTURE AND APPLICATIONS THEREOF 公开/授权日：2009-05-14
信息查询
IPC分类:
