Invention Grant
- Patent Title: Stylus removal mechanism
- Patent Title (中): 触笔去除机制
-
Application No.: US11298873Application Date: 2005-12-09
-
Publication No.: US07576980B2Publication Date: 2009-08-18
- Inventor: Chun-Jen Lin
- Applicant: Chun-Jen Lin
- Applicant Address: HK Kowloon
- Assignee: FIH (Hong Kong) Limited
- Current Assignee: FIH (Hong Kong) Limited
- Current Assignee Address: HK Kowloon
- Agent Steven M. Reiss
- Priority: TW93219879U 20041210
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/00

Abstract:
A stylus removal mechanism (100), used in portable electronic devices, includes a main body (10), having a latching hole (1121) defined therein, and an elastic device (20). The elastic device is fixed at the main body and includes an elastic member (21), a removal member (22), and a connecting pole (25). The elastic member includes two ends (210) respectively engaging with the removal member and the main body. The removal member has a cam (240) and a conducting groove (24) defined around the cam. The conducting groove has a latching portion (241). The connecting pole includes one end (251), received in the latching hole of the main body, and another end (252) movably received in the conducting groove.
Public/Granted literature
- US20060126287A1 Stylus removal mechanism Public/Granted day:2006-06-15
Information query