Invention Grant
- Patent Title: Stent with reduced profile
- Patent Title (中): 支架缩小
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Application No.: US10813903Application Date: 2004-03-31
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Publication No.: US07578840B2Publication Date: 2009-08-25
- Inventor: Darin Schaeffer
- Applicant: Darin Schaeffer
- Applicant Address: US IN Bloomington
- Assignee: Cook Incorporated
- Current Assignee: Cook Incorporated
- Current Assignee Address: US IN Bloomington
- Agency: Brinks Hofer Gilson & Lione
- Main IPC: A61F2/06
- IPC: A61F2/06
Abstract:
A stent is provided which can be crimped to a reduced profile with reduced stress in the stent, while maintaining the strength and flexibility of the stent so that it can be advanced through the narrow passageways present in a patient's body and then expanded to dilate and/or circumferentially support the vessel wall. Also provided is a method of deploying such a stent.
Public/Granted literature
- US20050222670A1 Stent with reduced profile Public/Granted day:2005-10-06
Information query
IPC分类:
