Invention Grant
US07579263B2 Threading-dislocation-free nanoheteroepitaxy of Ge on Si using self-directed touch-down of Ge through a thin SiO2 layer 有权
使用Ge通过薄SiO 2层的自我定向触摸,Si上的Ge的穿线 - 无位错纳米外延

  • Patent Title: Threading-dislocation-free nanoheteroepitaxy of Ge on Si using self-directed touch-down of Ge through a thin SiO2 layer
  • Patent Title (中): 使用Ge通过薄SiO 2层的自我定向触摸,Si上的Ge的穿线 - 无位错纳米外延
  • Application No.: US10935228
    Application Date: 2004-09-08
  • Publication No.: US07579263B2
    Publication Date: 2009-08-25
  • Inventor: Sang HanQiming Li
  • Applicant: Sang HanQiming Li
  • Applicant Address: US NM Albuquerque
  • Assignee: STC.UNM
  • Current Assignee: STC.UNM
  • Current Assignee Address: US NM Albuquerque
  • Agency: MH2 Technology Law Group LLP
  • Main IPC: H01L21/20
  • IPC: H01L21/20 C30B25/02
Threading-dislocation-free nanoheteroepitaxy of Ge on Si using self-directed touch-down of Ge through a thin SiO2 layer
Abstract:
A method of forming a virtually defect free lattice mismatched nanoheteroepitaxial layer is disclosed. The method includes forming an interface layer on a portion of a substrate. A plurality of seed pads are then formed by self-directed touchdown by exposing the interface layer to a material comprising a semiconductor material. The plurality of seed pads, having an average width of about 1 nm to 10 nm, are interspersed within the interface layer and contact the substrate. An epitaxial layer is then formed by lateral growth of the seed pads over the interface layer.
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