A connector assembly is provided that includes an upper element and a lower element in contact with the upper element along a contour-matched interface. The first element and the second element are dielectric and each comprise a recess and a groove, the recesses cooperatively forming a cavity and the grooves cooperatively forming a channel communicating the cavity to exterior surfaces of the upper element and the lower element. A conductive plug is disposed within the cavity and is adapted for engaging a lead wire and a terminal pad. Preferably, the connector assembly further includes a clamping device for securing the connector assembly to a substrate and a spring element disposed within the cavity, wherein the conductive plug is disposed between the terminal pad and the spring such that the spring biases the conductive plug against the terminal pad.