Invention Grant
- Patent Title: Antenna device
- Patent Title (中): 天线设备
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Application No.: US11783291Application Date: 2007-04-06
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Publication No.: US07583234B2Publication Date: 2009-09-01
- Inventor: Hideki Iwata , Shigemi Kurashima , Masahiro Yanagi , Takashi Yuba , Takashi Arita
- Applicant: Hideki Iwata , Shigemi Kurashima , Masahiro Yanagi , Takashi Yuba , Takashi Arita
- Applicant Address: JP Tokyo
- Assignee: Fujitsu Component Limited
- Current Assignee: Fujitsu Component Limited
- Current Assignee Address: JP Tokyo
- Agency: Staas & Halsey LLP
- Priority: JP2006-248631 20060913
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01Q9/28

Abstract:
An antenna device is disclosed that includes a dielectric substrate having first and second surfaces facing away from each other, an element pattern formed on the first surface of the dielectric substrate, a conductive pattern formed on the first surface of the dielectric substrate so as to extend from the feeding point of the element pattern, and a ground pattern formed on the second surface of the dielectric substrate so as to form a microstrip line in cooperation with the conductive pattern. The ground pattern has a cutout part formed in a portion thereof opposing the feeding point.
Public/Granted literature
- US20080062047A1 Antenna device Public/Granted day:2008-03-13
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