Invention Grant
- Patent Title: Method and apparatus for processing a wafer
- Patent Title (中): 用于处理晶片的方法和装置
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Application No.: US11978004Application Date: 2007-10-26
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Publication No.: US07585686B2Publication Date: 2009-09-08
- Inventor: Steven Verhaverbeke , J Kelly Truman , Christopher T Lane , Sasson R Somekh
- Applicant: Steven Verhaverbeke , J Kelly Truman , Christopher T Lane , Sasson R Somekh
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/00 ; B65G25/00 ; B66C17/08
Abstract:
A method of a single wafer wet/dry cleaning apparatus comprising: a transfer chamber having a wafer handler contained therein; a first single wafer wet cleaning chamber directly coupled to the transfer chamber; and a first single wafer ashing chamber directly coupled to the transfer chamber.
Public/Granted literature
- US20080138917A1 Method and apparatus for processing a wafer Public/Granted day:2008-06-12
Information query
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