Invention Grant
- Patent Title: Heat dissipation module
- Patent Title (中): 散热模块
-
Application No.: US11268515Application Date: 2005-11-08
-
Publication No.: US07586742B2Publication Date: 2009-09-08
- Inventor: Yung-Yu Chiu , Te-Tsai Chuang , Kuo-Cheng Lin , Wen-Shi Huang
- Applicant: Yung-Yu Chiu , Te-Tsai Chuang , Kuo-Cheng Lin , Wen-Shi Huang
- Applicant Address: TW Taoyuan Hsien
- Assignee: Delta Electronics Inc.
- Current Assignee: Delta Electronics Inc.
- Current Assignee Address: TW Taoyuan Hsien
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW93141435A 20041230
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K5/00 ; H05K7/00

Abstract:
A heat dissipation module includes a first heat dissipation apparatus, a second heat dissipation apparatus, at least one first flapper and at least one second flapper. The first heat dissipation apparatus has a first airflow passage, and the second heat dissipation apparatus has a second airflow passage. The first flappers and the second flappers are separately disposed within the first airflow passage and the second airflow passage. The first flappers and the second flappers are moved to an open position due to force generated by air flowing through the first airflow passage and the second airflow passage, and are moved to a closed position after the force is removed.
Public/Granted literature
- US20060146494A1 Heat dissipation module Public/Granted day:2006-07-06
Information query