Invention Grant
- Patent Title: Modular floor tile with multi level support system
- Patent Title (中): 具多层次支撑系统的模块化地砖
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Application No.: US11379109Application Date: 2006-04-18
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Publication No.: US07587865B2Publication Date: 2009-09-15
- Inventor: Jorgen J. Moller, Jr.
- Applicant: Jorgen J. Moller, Jr.
- Agency: Holland & Hart
- Main IPC: E04F15/02
- IPC: E04F15/02 ; E04F15/22

Abstract:
The principles described herein provide floor tiles and modular floors. Some embodiments of the floor tiles and modular floors include multiple levels of support. One of the levels of support may be a resilient level that compresses comfortably under a load. Another level of support may include a generally rigid level that supports the floor or tile after the resilient level has compressed a predetermined distance. One embodiment includes a third generally rigid level of support that supports the floor or tile under certain loads. Some embodiments of the floor tiles include inserts for increased traction. The inserts may be removable and protrude from a top surface and/or a bottom plane of the floor tiles. The tiles may include a locking system that allows adjacent tiles to interlock, while also permitting a predetermined amount of lateral sliding relative to one another. The modular tiles may be injection molded and the inserts and the resilient support level may comprise an elastomer.
Public/Granted literature
- US20060283118A1 MODULAR FLOOR TILE WITH MULTI LEVEL SUPPORT SYSTEM Public/Granted day:2006-12-21
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