Invention Grant
- Patent Title: Overvoltage protection materials and process for preparing same
- Patent Title (中): 过电压保护材料及其制备方法
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Application No.: US11468736Application Date: 2006-08-30
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Publication No.: US07589611B2Publication Date: 2009-09-15
- Inventor: Chi-Ming Chan , Kai-Mo Ng , Catherine Yuen-Chien Wong , Ying Kit Cheung
- Applicant: Chi-Ming Chan , Kai-Mo Ng , Catherine Yuen-Chien Wong , Ying Kit Cheung
- Applicant Address: CN Hong Kong
- Assignee: The Hong Kong Universtiy of Science and Technology
- Current Assignee: The Hong Kong Universtiy of Science and Technology
- Current Assignee Address: CN Hong Kong
- Agency: Schwabe Williamson & Wyatt P.C.
- Main IPC: H01C7/10
- IPC: H01C7/10

Abstract:
The invention provides a process for preparing an overvoltage protection material comprising: (i) preparing a mixture comprising a polymer binder precursor and a conductive material; and (ii) heating the mixture to cause reaction of the polymer binder precursor and generate a polymer matrix having conductive material dispersed therein, wherein the polymer binder precursor is chosen such that substantially no solvent is generated during the reaction.
Public/Granted literature
- US20070102675A1 OVERVOLTAGE PROTECTION MATERIALS AND PROCESS FOR PREPARING SAME Public/Granted day:2007-05-10
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