发明授权
- 专利标题: Laminated electronic component and method for manufacturing the same
- 专利标题(中): 层压电子部件及其制造方法
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申请号: US12030360申请日: 2008-02-13
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公开(公告)号: US07589951B2公开(公告)日: 2009-09-15
- 发明人: Tatsuo Kunishi , Makoto Ogawa , Akihiro Motoki
- 申请人: Tatsuo Kunishi , Makoto Ogawa , Akihiro Motoki
- 申请人地址: JP Kyoto
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 代理机构: Keating & Bennett, LLP
- 优先权: JP2006-051218 20060227
- 主分类号: H01G4/228
- IPC分类号: H01G4/228
摘要:
A laminated body is prepared, in which at an end surface at which internal electrodes are exposed, the internal electrodes disposed adjacently are electrically isolated from each other, and a distance between the internal electrodes disposed adjacently is about 20 μm or less when measured along the thickness direction of an insulator layer, and a withdrawn-depth of the internal electrodes is about 1 μm or less when measured from the end surface. In a step of electroless plating, plating deposits formed at the end portions of the plurality of internal electrodes are increased in size so as to be connected to each other.
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