发明授权
- 专利标题： Multilayer electronic device and method for manufacturing the same
- 专利标题（中）： 多层电子器件及其制造方法
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申请号： US12109371申请日： 2008-04-25
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公开(公告)号： US07589952B2公开(公告)日： 2009-09-15
- 发明人: Akihiro Motoki , Kenichi Kawasaki , Makoto Ogawa , Shigeyuki Kuroda , Tatsuo Kunishi
- 申请人： Akihiro Motoki , Kenichi Kawasaki , Makoto Ogawa , Shigeyuki Kuroda , Tatsuo Kunishi
- 申请人地址： JP Kyoto
- 专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人地址： JP Kyoto
- 代理机构： Keating & Bennett, LLP
- 优先权： JP2006-315074 20061122
- 主分类号： H01G4/228
- IPC分类号： H01G4/228
摘要：
A multilayer electronic device includes a laminate and an external electrode that is formed on an end surface of the laminate after a plurality of conductive particles having a particle diameter of about 1 μm or more is adhered to the end surface of the laminate, for example, by a sandblast method or a brush polishing method. The external electrode is defined by a plating film that is formed by electroplating or electroless plating.
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