发明授权
US07591651B2 Substrate with helically curved terminals superimposed and connected to identical terminals on a second substrate
有权
具有叠加并连接到第二基板上相同端子的螺旋形弯曲端子的基板
- 专利标题： Substrate with helically curved terminals superimposed and connected to identical terminals on a second substrate
- 专利标题（中）： 具有叠加并连接到第二基板上相同端子的螺旋形弯曲端子的基板
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申请号： US11837441申请日： 2007-08-10
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公开(公告)号： US07591651B2公开(公告)日： 2009-09-22
- 发明人: Norio Imaoka
- 申请人： Norio Imaoka
- 申请人地址： JP Nagano, Azumino-shi
- 专利权人： Epson Imaging Devices Corporation
- 当前专利权人： Epson Imaging Devices Corporation
- 当前专利权人地址： JP Nagano, Azumino-shi
- 代理机构： Lowe Hauptman Ham & Berner, LLP
- 优先权： JP2006-262233 20060927
- 主分类号： H01R12/00
- IPC分类号： H01R12/00
摘要：
A mounting structure has a substrate with a plurality of terminals having helically curved portions superimposed and electrically connected to a plurality of identical helically curved terminals on a second substrate. This increases the precision of positioning the terminals on one substrate on to those on a second substrate by relatively rotating the first and second substrates which have reference points coincident with each other.