发明授权
US07591863B2 Laminating system, IC sheet, roll of IC sheet, and method for manufacturing IC chip
有权
复合体系，IC片，IC片卷，IC芯片的制造方法
- 专利标题： Laminating system, IC sheet, roll of IC sheet, and method for manufacturing IC chip
- 专利标题（中）： 复合体系，IC片，IC片卷，IC芯片的制造方法
-
申请号： US11168353申请日： 2005-06-29
-
公开(公告)号： US07591863B2公开(公告)日： 2009-09-22
- 发明人: Ryosuke Watanabe , Hidekazu Takahashi , Takuya Tsurume , Yasuyuki Arai , Yasuko Watanabe , Miyuki Higuchi
- 申请人： Ryosuke Watanabe , Hidekazu Takahashi , Takuya Tsurume , Yasuyuki Arai , Yasuko Watanabe , Miyuki Higuchi
- 申请人地址： JP Atsugi-shi, Kanagawa-ken
- 专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址： JP Atsugi-shi, Kanagawa-ken
- 代理机构： Robinson Intellectual Property Law Office, P.C.
- 代理商 Eric J. Robinson
- 优先权： JP2004-210620 20040716
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/64
摘要：
The invention provides a laminating system in which one of second and third substrates for sealing a thin film integrated circuit is supplied to a first substrate having the plurality of thin film integrated circuit while being extruded in a heated and melted state, and further rollers are used for supplying the other substrate, receiving IC chips, separating, and sealing. Processes of separating the thin film integrated circuits provided over the first substrate, sealing the separated thin film integrated circuits, and receiving the sealed thin film integrated circuits can be continuously carried out by rotating the rollers. Thus, the production efficiency can be extremely improved.
公开/授权文献
信息查询
IPC分类:
