发明授权
- 专利标题: LED package frame and LED package having the same
- 专利标题(中): LED封装框架和LED封装相同
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申请号: US11319101申请日: 2005-12-28
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公开(公告)号: US07592631B2公开(公告)日: 2009-09-22
- 发明人: Young Sam Park , Seung Ick Lee , Hun Joo Hahm , Hyung Suk Kim , Bum Jin Kim , Young June Jeong , Ho Sik Ahn , Jung Kyu Park
- 申请人: Young Sam Park , Seung Ick Lee , Hun Joo Hahm , Hyung Suk Kim , Bum Jin Kim , Young June Jeong , Ho Sik Ahn , Jung Kyu Park
- 申请人地址: KR Suwon, Kyungki-Do
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon, Kyungki-Do
- 代理机构: Lowe Hauptman Ham & Berner
- 优先权: KR10-2005-0008773 20050131
- 主分类号: H01L27/15
- IPC分类号: H01L27/15 ; H01L31/12 ; H01L33/00
摘要:
An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.
公开/授权文献
- US20060169999A1 LED package frame and LED package having the same 公开/授权日:2006-08-03