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发明授权
US07592708B2 Package board, semiconductor package, and fabricating method thereof 有权
封装板，半导体封装及其制造方法

Package board, semiconductor package, and fabricating method thereof
摘要：
With a semiconductor package according to an aspect of the present invention comprising a board having circuit lines, solder resist formed on a surface of the board, and a chip mounted on the board and having at least one bump attached to at least a portion of the circuit lines, where the solder resist comprises a perimeter groove, which exposes at least a portion of the circuit lines, and an extension groove, which is connected to the perimeter groove, and where encapsulant is filled in the perimeter groove and the extension groove, the filling characteristics of the encapsulant is improved for greater reliability in the electrical connections between the chip and the board.
摘要（中）：

根据本发明的一个方面的半导体封装，其包括具有电路线的板，形成在所述板的表面上的阻焊剂和安装在所述板上的芯片，并且具有附着到所述板的至少一部分上的至少一个凸块 电路线，其中阻焊剂包括暴露至少一部分电路线的周边凹槽和连接到周边凹槽的延伸凹槽，并且其中密封剂填充在周边凹槽和延伸凹槽中， 提高了密封剂的填充特性，以便在芯片和电路板之间的电连接中获得更高的可靠性。

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