发明授权
US07594328B2 Method of forming a slotted substrate with partially patterned layers
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形成具有部分图案化层的开槽衬底的方法
- 专利标题： Method of forming a slotted substrate with partially patterned layers
- 专利标题（中）： 形成具有部分图案化层的开槽衬底的方法
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申请号： US11069421申请日： 2005-02-28
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公开(公告)号： US07594328B2公开(公告)日： 2009-09-29
- 发明人: Roberto A. Pugliese, Jr. , Mark H. MacKenzie , Thomas E. Pettit , Victorio A. Chavarria , Steven P Storm , Allen H Smith , Tony Cruz-Uribe
- 申请人： Roberto A. Pugliese, Jr. , Mark H. MacKenzie , Thomas E. Pettit , Victorio A. Chavarria , Steven P Storm , Allen H Smith , Tony Cruz-Uribe
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 主分类号： B23P17/00
- IPC分类号： B23P17/00 ; B41J2/045
摘要：
A method of forming a slotted substrate that includes patterning a thin film over a substrate so that at least a portion of the substrate within a slot region is not covered by the thin film. In addition, a slot is formed in the substrate through the slot region that extends through the substrate and the thin film, wherein a chip count in a shelf surrounding the slot is minimized when the slot is formed in the substrate through the thin film in the slot region.
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