发明授权
- 专利标题: Molding apparatus having ejector sleeve and ejector pin
- 专利标题(中): 具有推出器套筒和顶针的成型设备
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申请号: US11475182申请日: 2006-06-27
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公开(公告)号: US07597550B2公开(公告)日: 2009-10-06
- 发明人: Sang-hun Lee , Jong-won Lee , Sang-bae Lee
- 申请人: Sang-hun Lee , Jong-won Lee , Sang-bae Lee
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Stanzione & Kim LLP
- 优先权: KR10-2005-0057754 20050630
- 主分类号: B29C45/40
- IPC分类号: B29C45/40
摘要:
An molding apparatus includes a core having a recessed part corresponding to a protruding part of a molded article, an ejector pin movably provided in the core to eject the molded article, an ejector sleeve movably provided in the core to push the protruding part of the molded article, and an ejector actuating part to move the ejector pin and the ejector sleeve together to a separation position where the protruding part of the molded article is separated from the recessed portion of the core, to bring the ejector sleeve into a stop position so that the ejector sleeve does not protrude from the core, and to move the ejector pin from the separation position to a removal position where the molded article is spaced apart from the core by a predetermined distance. Accordingly, the molding apparatus is capable of preventing damage caused on an ejector sleeve.
公开/授权文献
- US20070003659A1 Molding apparatus 公开/授权日:2007-01-04
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