发明授权
US07598147B2 Method of forming CMOS with Si:C source/drain by laser melting and recrystallization 有权
通过激光熔融和重结晶用Si:C源极/漏极形成CMOS的方法

Method of forming CMOS with Si:C source/drain by laser melting and recrystallization
摘要:
A method of forming crystalline Si:C in source and drain regions is provided. After formation of shallow trench isolation and gate electrodes of field effect transistors, gate spacers are formed on gate electrodes. Preamorphization implantation is performed in the source and drain regions, followed by carbon implantation. The upper portion of the source and drain regions comprises an amorphous mixture of silicon, germanium, and/or carbon. An anti-reflective layer is deposited to enhance the absorption of a laser beam into the silicon substrate. The laser beam is scanned over the silicon substrate including the upper source and drain region with the amorphous mixture. The energy of the laser beam is controlled so that the temperature of the semiconductor substrate is above the melting temperature of the amorphous mixture but below the glass transition temperature of silicon oxide so that structural integrity of the semiconductor structure is preserved.
信息查询
0/0