Invention Grant
- Patent Title: Capacitor structure for integrated circuit
- Patent Title (中): 集成电路的电容结构
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Application No.: US11675721Application Date: 2007-02-16
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Publication No.: US07598592B2Publication Date: 2009-10-06
- Inventor: Chun-Sheng Chen , Ying-Che Tseng
- Applicant: Chun-Sheng Chen , Ying-Che Tseng
- Applicant Address: TW Taipei
- Assignee: Via Technologies, Inc.
- Current Assignee: Via Technologies, Inc.
- Current Assignee Address: TW Taipei
- Agency: Thomas, Kayden, Horstemeyer & Risley
- Priority: TW95145128A 20061205
- Main IPC: H01L27/108
- IPC: H01L27/108

Abstract:
A capacitor structure for an integrated circuit. An insulating layer is disposed on a substrate. A first conductive line is embedded in a first level of the insulating layer. A second conductive line is embedded in a second level of the insulating layer lower than the first level and has a projection onto the substrate completely covered by the first conductive line. A third conductive line is embedded in the second level of the insulating layer and separated from the second conductive line by a predetermined space, and has a projection onto the substrate partially covered by the first conductive line. The second conductive line is coupled to the first conductive line by at least one first conductive plug and has a polarity opposite to the third conductive line.
Public/Granted literature
- US20080128859A1 CAPACITOR STRUCTURE FOR INTEGRATED CIRCUIT Public/Granted day:2008-06-05
Information query
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