A socket connector is bonded to a circuit board by solder materials. The solder materials are well arranged so that no short circuits occur. The socket connector can be applied in a wide range of uses with high yield and reduced cost. The socket connector has an insulative housing having a plurality of terminals and a solder material therein. The socket connector is characterized by the insulative housing being provided with a plurality of overflow holes in a direction along which the insulative housing and terminals apply pressure to the solder material.