发明授权
- 专利标题： Grinding machine having grinder head and method of manufacturing semiconductor device by using the grinding machine
- 专利标题（中）： 具有研磨机的研磨机和使用研磨机制造半导体器件的方法
-
申请号： US11905743申请日： 2007-10-03
-
公开(公告)号： US07601051B2公开(公告)日： 2009-10-13
- 发明人: Yasuo Tanaka
- 申请人： Yasuo Tanaka
- 申请人地址： JP Tokyo
- 专利权人： Oki Semiconductor Co., Ltd
- 当前专利权人： Oki Semiconductor Co., Ltd
- 当前专利权人地址： JP Tokyo
- 代理机构： Rabin & Berdo, P.C.
- 优先权： JP2006-334620 20061212
- 主分类号： B24B1/00
- IPC分类号： B24B1/00
摘要：
A grinding machine for grinding a workpiece, including a chucking table having a chucking area and a grinder head. The grinder head includes a spinning disk rotating about a rotation axis and a plurality of grindstones, which are circularly arranged on a surface of the spinning disk, whereby a slit is created between the adjacent grindstones, wherein both of the adjacent grindstones is arranged to make contact with an edge of the workpiece while grinding the workpiece.
公开/授权文献
信息查询
