Invention Grant
- Patent Title: Resistor compositions for electronic circuitry applications
- Patent Title (中): 电子电路应用的电阻组合物
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Application No.: US11985950Application Date: 2007-11-19
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Publication No.: US07604754B2Publication Date: 2009-10-20
- Inventor: John D. Summers
- Applicant: John D. Summers
- Applicant Address: US DE Wilmington
- Assignee: E. I. du Pont de Nemours and Company
- Current Assignee: E. I. du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Agent Konrad S. Kaeding
- Main IPC: H01B1/00
- IPC: H01B1/00 ; H01B1/02 ; H01B1/12 ; C08G73/10 ; B22F7/00
Abstract:
Resistor compositions are disclosed, made from polymer thick film resistor formulations comprising a polyimide component, a sterically hindered hydrophobic epoxy component and a solvent component having a Hanson polar solubility parameter between 2.1 and 3.0 and having a normal boiling point between 210 and 260° C. The weight ratio of polyimide component (“A”) to epoxy component (“B”) is A:B, where A is between and including 1 to 15 and where B is 1.
Public/Granted literature
- US20080185561A1 Resistor compositions for electronic circuitry applications Public/Granted day:2008-08-07
Information query
