A hot melt adhesive hose assembly has a redundant control circuit fixedly mounted thereon which comprises a pair of heater circuits for heating a hot melt adhesive hose assembly to a predetermined temperature level, and a pair of temperature sensors which are used to sense the temperature of the hot melt adhesive hose assembly wherein the sensed temperature level will be used to control energization of the heater circuits in order to maintain the desired temperature level. A first one of the heater circuits is initially electrically connected to the hot melt adhesive hose assembly electrical circuitry, and in a similar manner, a first one of the temperature sensors is likewise electrically connected to the hot melt adhesive hose assembly electrical circuitry. Should a failure occur within the first one of the heater circuits, or within a first one of the temperature sensors, electrical switch mechanisms are activated so as to effectively remove the first, failed heater circuit or the first failed temperature sensor from the hot melt adhesive hose assembly electrical circuitry, and substantially simultaneously therewith, electrically connect the second one of the heater circuits or the second one of the temperature sensors to the hot melt adhesive hose assembly electrical circuitry. The hot melt adhesive hose assembly, with its redundant control circuit comprising the pair of heater circuits and the pair of temperature sensors, thus comprises a self-contained, stand-alone, independent operative component that can be utilized in conjunction with any hot melt adhesive supply unit (ASU).