Invention Grant
- Patent Title: High-dielectric constant metal-ceramic-polymer composite material and method for producing embedded capacitor using the same
- Patent Title (中): 高介电常数金属陶瓷聚合物复合材料及其制造方法
-
Application No.: US11358087Application Date: 2006-02-22
-
Publication No.: US07609504B2Publication Date: 2009-10-27
- Inventor: Eun Tae Park , Jeong Joo Kim , Hee Young Lee , Eun Sub Lim , Jong Chul Lee , Yul Kyo Chung
- Applicant: Eun Tae Park , Jeong Joo Kim , Hee Young Lee , Eun Sub Lim , Jong Chul Lee , Yul Kyo Chung
- Applicant Address: KR Kyungki-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Kyungki-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2005-0027765 20050401
- Main IPC: H01G4/06
- IPC: H01G4/06

Abstract:
The invention relates to a high-dielectric constant metal/ceramic/polymer composite material and a method for producing an embedded capacitor.As ceramic particles having a relatively small size are bound to the surface of metal particles having a relatively large size by mixing, the occurrence of percolation can be prevented without coating the metal particles, and at the same time, the capacitance of an embedded capacitor can be increased. In addition, a process for coating the surface of the metal particles can be omitted, thus contributing to the simplification of the overall preparation procedure.
Public/Granted literature
Information query