发明授权
- 专利标题: Semiconductor device
- 专利标题(中): 半导体器件
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申请号: US11783933申请日: 2007-04-13
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公开(公告)号: US07612404B2公开(公告)日: 2009-11-03
- 发明人: Akihito Yamamoto , Masayuki Tanaka , Katsuyuki Sekine , Daisuke Nishida , Ryota Fujisuka , Katsuaki Natori , Hirokazu Ishida , Yoshio Ozawa
- 申请人: Akihito Yamamoto , Masayuki Tanaka , Katsuyuki Sekine , Daisuke Nishida , Ryota Fujisuka , Katsuaki Natori , Hirokazu Ishida , Yoshio Ozawa
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 优先权: JP2006-112190 20060414
- 主分类号: H01L29/788
- IPC分类号: H01L29/788
摘要:
A semiconductor device includes semiconductor substrate, isolation insulating film, nonvolatile memory cells, each of the cells including tunnel insulating film, FG electrode, CG electrode, interelectrode insulating film between the CG and FG electrodes and including a first insulating film and a second insulating film on the first insulating film and having higher permittivity than the first insulating film, the interelectrode insulating film being provided on a side wall of the floating gate electrode in a cross-section view of a channel width direction of the cell, thickness of the interelectrode insulating film increasing from an upper portion of the side wall toward a lower portion of the side wall, thickness of the second insulating film on an upper corner of the FG electrode being thicker than thickness of the second insulating film on the other portions of the side wall in the cross-section view of the channel width direction.
公开/授权文献
- US20070241388A1 Semiconductor device 公开/授权日:2007-10-18
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