Invention Grant
US07612429B2 Chip resistor, process for producing the same, and frame for use therein
有权
片式电阻器，其制造方法和用于其中的框架
- Patent Title: Chip resistor, process for producing the same, and frame for use therein
- Patent Title (中): 片式电阻器，其制造方法和用于其中的框架
-
Application No.: US10533489Application Date: 2003-10-30
-
Publication No.: US07612429B2Publication Date: 2009-11-03
- Inventor: Torayuki Tsukada , Tadatoshi Miwa
- Applicant: Torayuki Tsukada , Tadatoshi Miwa
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2002-318648 20021031; JP2002-348883 20021129; JP2002-348884 20021129; JP2002-353514 20021205
- International Application: PCT/JP03/13964 WO 20031030
- International Announcement: WO2004/040592 WO 20040513
- Main IPC: H01L29/93
- IPC: H01L29/93
Abstract:
A chip resistor (A1) comprises a first insulation layer (2A) covering the regions between a plurality of electrodes (3) on a rear surface (10a) of a resistor (1), and a second insulation layer covering a pair of side faces of the resistor (1). Inadvertent adhesion of solder to an improper part of the resistor (1) can thereby be eliminated. A solder layer (4) is preferably formed on a pair of end faces (10d) of the resistor (1). In so doing, a solder fillet can be formed appropriately.
Public/Granted literature
- US20060097340A1 Chip resistor, process for producing the same, and frame for use therein Public/Granted day:2006-05-11
Information query
IPC分类:
